مكان المنشأ
Guangdong, China
سماك النحاس
0.4-2mil(10-50um)
أصغر حجم الحفرة
0.1mm(4mil)for HDI / 0.15mm(6mil)
أصغر عرض الخط
0.075mm/0.075mm(3mil/3mil)
تشطيبات السطح
HASL/OSP/Ag/ENIG/ENEPIG/Immersion silver/Tin
PCB Test
Flying probe and AOI (Default)/Fixture Test
Base, Cover film, Stiffeners thickness:
0.5mil, 1.0mil, 2.0mil, 3.0mil, 4.0mil, 5.0mil, 6.0mil,0.10um
BGA Ball Pitch
1mm ~ 3mm(4mil ~ 12mil)
PCB Assembly Method
SMT, Through-hole, Mixed, BGA
PCB Assembly Test
Visual Inspection (default), AOI, FCT, X-RAY
Hi-TG FR4 Material
Tg-130 Tg-140 Tg-160 Tg-170
Electrical Testing
Net List Test, Flying Probe Test, Through Hole Test, Dual Access Test
Certificate Standard
IPC-A-600H Class 2, Class 3, TS16949,ROHS and as your need
Special requirements
Buried and blind vias, Impedance control, via plug, BGA soldering etc.